Ultra-Thin Electrostatic Dissipative (ESD) Polyimide Labels for M710 and BMP71
Part Number: 176943
£109.57
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About this Product
Static Dissipative Polyimide (B-768) withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labelling.| Order Reference | M7-9-768 |
|---|---|
| Dimensions Metric | 16.51 mm (W) x 5.08 mm (H) |
| Height Metric | 5.08 mm |
| Labeltape Size Metric | 5.08 mm H x 16.51 mm W |
| Vertical Repeat Metric | 8.26 mm |
| Web Width Metric | 26.97 mm |
| Width Metric | 16.51 mm |
| Adhesive Type | Static Dissipative Permanent Acrylic |
| Average Outdoor Durability | Not Recommended |
| Brady Material Number | B-768 |
| Compatible Surface Types | High Surface Energy |
| Finish | Gloss |
| Indoor Or Outdoor Use | Indoor Use |
| Label Properties | Heat Resistant;Permanent Adhesive;Electrostatic Dissipative |
| Material | Static Dissipative Polyimide |
| Material Type | Polyimide |
| Maximum Service Temperature C | 300 °C |
| Minimum Service Temperature C | -80 °C |
| Performance Characteristics | Abrasion-resistant;High heat resistant;Low temperature resistance;Solvent/Chemical resistance;Electrostatic dissipative |
| Service Temperature Range C | -80 °C - 300 °C |
| Thickness Metric | 0.078 mm |
| Application | Circuit board labelling |
| Board Application | Through Hole Technology - Top;Through Hole Technology - Bottom;Surface Mount Technology (SMT) - Top/Bottom;After Process;Static Dissipative |
| Colour | White |
| Continuous Or Die Cut | Die-cut |
| Corner Type | Rounded Corners |
| Pre Printed Areas On Label | None |
| Print Technology | Thermal Transfer |
| Printer And Label Applications | Circuit Board;General Identification |
| Printer Compatibility |
BMP71 M710 |
| Printer Supply Or Pre Printed | Printer supply |
| Quantity Per Roll | 750 |
| Quantity Per Row | 1 |
| Recommended Ribbon Series | R6300 |
| Ribbon Series | R6300 |
| Shape | Rectangle |
| Smart Cell | Yes |
| Surface Mount Technology Smt | Yes, this material will work with this application |
| Through Hole Technology | Top: Yes, Bottom: Yes |