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Heat Resistant Polyimide Labels for M610, M611, BMP61, M710 (with media adapter) and BMP71 (with media adapter)
Part Number: 176961
£140.98
+ VAT
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About this Product
High Temperature Polyimide (B-797) withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labelling.Order Reference | M6-6-797 |
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Core Diameter Metric | 25.40 mm |
Dimensions Metric | 12.70 mm (W) x 6.99 mm (H) |
Height Metric | 6.99 mm |
Labeltape Size Metric | 6.99 mm H x 12.70 mm W |
Vertical Repeat Metric | 10.16 mm |
Web Width Metric | 20.62 mm |
Width Metric | 12.70 mm |
Adhesive Type | Permanent Acrylic |
Average Outdoor Durability | Not Recommended |
Brady Material Number | B-797 |
Compatible Surface Types | High Surface Energy |
Finish | Gloss |
Indoor Or Outdoor Use | Indoor Use |
Label Properties | Heat Resistant;Permanent Adhesive |
Material | Polyimide |
Material Type | Polyimide |
Maximum Service Temperature C | 300 °C |
Minimum Service Temperature C | -80 °C |
Performance Characteristics | Abrasion-resistant;High heat resistant;Low temperature resistance;Solvent/Chemical resistance |
Service Temperature Range C | -80 °C - 300 °C |
Surface | For smooth surfaces |
Thickness Metric | 0.104 mm |
Application |
Circuit board labelling Component and equipment labelling |
Board Application | Through Hole Technology - Top;Through Hole Technology - Bottom;Surface Mount Technology (SMT) - Top/Bottom |
Colour | White |
Continuous Or Die Cut | Die-cut |
Corner Type | Rounded Corners |
Pre Printed Areas On Label | None |
Print Technology | Thermal Transfer |
Printer And Label Applications | Circuit Board;General Identification |
Printer Compatibility |
M610 M611 M710 (with media adapter) BMP61 BMP71 (with media adapter) |
Printer Supply Or Pre Printed | Printer supply |
Quantity Per Roll | 750 |
Quantity Per Row | 1 |
Recommended Ribbon Series | R6300 |
Ribbon Series | R6300 |
Shape | Rectangle |
Smart Cell | Yes |
Surface Mount Technology Smt | Yes, this material will work with this application |
Through Hole Technology | Top: Yes, Bottom: Yes |