Heat Resistant Polyimide Labels for M610, M611, BMP61, M710 (with media adapter) and BMP71 (with media adapter)
Part Number: 173777
£46.77
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About this Product
High Temperature Polyimide (B-727) withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labelling.| Order Reference | M6-2-727 |
|---|---|
| Dimensions Metric | 50,80 mm (W) x 6,35 mm (H) |
| Height Metric | 6.35 mm |
| Labeltape Size Metric | 6.35 mm H x 50.80 mm W |
| Vertical Repeat Metric | 53.98 mm |
| Web Width Metric | 20.62 mm |
| Width Metric | 50.80 mm |
| Adhesive Type | Permanent Acrylic |
| Brady Material Number | B-727 |
| Compatible Surface Types | High Surface Energy |
| Finish | Gloss |
| Indoor Or Outdoor Use | Indoor Use |
| Label Properties | Heat Resistant;Permanent Adhesive |
| Material | Polyimide |
| Material Type | Polyimide |
| Maximum Service Temperature C | 300 °C |
| Minimum Service Temperature C | -70 °C |
| Performance Characteristics | Abrasion resistance;High heat resistance;Low temperature resistance;Solvent/Chemical resistance |
| Service Temperature Range C | -70 °C - 300 °C |
| Surface | For smooth surfaces |
| Thickness Metric | 0.112 mm |
| Application |
Circuit board labelling Component and equipment labelling Temperature indicating labelling |
| Board Application | Through Hole Technology - Top;Through Hole Technology - Bottom;Surface Mount Technology (SMT) - Top/Bottom |
| Colour | White |
| Continuous Or Die Cut | Die-cut |
| Corner Type | Rounded Corners |
| Print Technology | Thermal Transfer |
| Printer And Label Applications | Circuit Board;General Identification |
| Printer Compatibility |
M610 M611 M710 (with media adapter) BMP61 BMP71 (with media adapter) |
| Printer Supply Or Pre Printed | Printer supply |
| Quantity Per Roll | 100 |
| Quantity Per Row | 1 |
| Recommended Ribbon Series | R6000HF |
| Ribbon Series | R6000HF |
| Shape | Rectangle |
| Smart Cell | Yes |
| Surface Mount Technology Smt | Yes, this material will work with this application |
| Through Hole Technology | Top: Yes, Bottom: Yes |